Assembly

SOLDER REFLOW
Leadless chip carriers, S.O. Packages, Discrete devices, Capacitors, Inductors

CHIP and WIRE

• 0.0007" to 0.0020" Gold thermosonic ball bonding
• Epoxy and Eutectic die attach
• Moly tab high temperature solder mount
• 0.001" to 0.010" Aluminum ultrasonic wedge bonding

PACKAGING

• Hermetic packages: welded Metal cans, soldered Ceramic
• Epoxy sealed Ceramic and Plastic enclosures, custom shapes
• Conformally Coated Epoxy or Silicone DIPs and SIPs
• Standard and Custom fabricated Heat Sinks

DISCRETE COMPONENTS

• Semiconductors:
  • Bipolar
  • ECL
  • MOS
  • Gate Arrays
  • FETs
    
    
• Chip Capacitors:
  • 5pF to 0.5uF
  • NPO through Z5U
  • Up to 50V
    
    
• Tantalum Capacitors:
  • 0.1uF to 50uF
  • Up to 25V
    
    
• Chip Resistors:
  • Thin Film
  • Tight tolerance
  • Low TCR
    
    
• Inductors and Chip Inductors:
  • Standard products and custom wound cores available
    
    
• Variable Capacitors:
  • 1 pF to 100 pF